Job Title: Metrology/Yield Engineering - Silicon Carbide
Division/Department: CCO_Technical Development
Location: Tianjin
Your Responsibilities:
1. Analyze the root cause of defects in silicon carbide devices.
2. Assess the impact of defects on the performance of the device.
3. Classify defect types based on their characteristics.
4. Develop and implement strategies to improve yield and reduce defects.
5. Collaborate with other departments, partner and external companies to
identify and solve process-related issues.
6. Perform data analysis and present findings to management and other
stakeholders.
7. Develop and maintain documentation related to the yield process and defect
analysis.
8. Stay up-to-date with the latest developments in the field of silicon
carbide and semiconductor materials.
Our Requirements:
1. Min. Bachelor's degree in Electrical Engineering, Materials Science,
Chemistry or a related field.
2. Minimum of 5 years of experience in the semiconductor industry, preferably
in the area of silicon carbide.
3. Strong understanding of silicon carbide materials, processes, and chemistry.
4. Experience with chip metrology tools and techniques.
5. Ability to identify and analyze the root cause of defects.
6. Familiarity with data analysis techniques and software tools.
7. Strong problem-solving and analytical skills.
8. Excellent communication and interpersonal skills.
9. Ability to work effectively in a fast-paced, team-oriented environment.